錫膏屬于非常粘稠的東西，怎么使用全自動點膠機進行點錫膏呢？
Solder paste is a very viscous thing, how to use the automatic dispensing machine to point solder paste? 
把錫膏分成A、B、C、D四組。A組錫膏無流向性，B組錫膏流向性一般，C組錫膏流向性可流動，D組錫膏流向性良好。
First, divide the solder paste into four groups: A, B, C and D. The flow direction of solder paste in group A was normal, that in group B was normal, that in group C was flowable, and that in group D was good.
然后采用全自動點膠搭載TS7000螺桿閥配TS500R控制器、普通點膠頭和全自動點膠機搭載AS9200噴射閥和控制器二種方案進行測試。
Then the test was carried out with two schemes: automatic dispensing with ts7000 screw valve and ts500r controller, ordinary dispensing head and automatic dispensing machine with as9200 injection valve and controller.
在測試過程中發(fā)現(xiàn)A組無流向性的錫膏用二種方案都沒有辦法完成點膠。
In the process of testing, it was found that group a solder paste without flow direction could not finish dispensing with either scheme.
B組流向性一般的錫膏用全自動點膠機搭載TS7000的螺桿閥和TS500R的控制器，螺桿閥直徑控制在1.3mm，在此配置下點膠效果比較穩(wěn)定。
In group B, the solder paste with general flow direction is equipped with ts7000 screw valve and ts500r controller, and the screw valve diameter is controlled at 1.3mm. Under this configuration, the dispensing effect is relatively stable.
C組可流向性錫膏用全自動點膠機的二種方案進行測試，發(fā)現(xiàn)全自動點膠機搭載TS7000的螺桿閥和TS500R的控制器，螺桿閥直徑控制在1.3mm，在此配置下點膠效果比較穩(wěn)定。但全自動點膠機搭載AS9200噴射閥和控制器，噴射閥點膠直徑控制在1.5mm發(fā)現(xiàn)噴射閥容易堵塞噴嘴。
Group C flowable solder paste was tested with two schemes of automatic dispensing machine. It was found that the automatic dispensing machine was equipped with ts7000 screw valve and ts500r controller, and the screw valve diameter was controlled at 1.3mm. Under this configuration, the dispensing effect was relatively stable. However, the automatic dispensing machine is equipped with as9200 injection valve and controller, and the dispensing diameter of the injection valve is controlled at 1.5mm. It is found that the injection valve is easy to block the nozzle.
D組流向性良好的錫膏用二種方案進行點膠的時候，點膠效果都比較穩(wěn)定。
In group D, when the solder paste with good flow direction was dispensing with the two schemes, the dispensing effect was relatively stable.
由此測試可以發(fā)現(xiàn)，用全自動點膠機點錫膏的時候，需要對錫膏進行稀釋，讓其具備流向性，這樣才可以用全自動點膠機進行點膠。而且流向性一般的錫膏只能用螺桿閥進行操作，流向性比較好的錫膏用噴射閥和螺桿閥都可以點錫膏。
From this test, we can find that when using the automatic dispenser to point the solder paste, we need to dilute the solder paste to make it flow, so that we can use the automatic dispenser for dispensing. And the solder paste with general flow direction can only be operated by screw valve, and the solder paste with good flow direction can be operated by spray valve and screw valve.
全自動點膠機根據(jù)錫膏特性對點膠設(shè)備配件進行選擇和參數(shù)調(diào)整，避免點膠時出現(xiàn)斷膠、出膠不均勻等現(xiàn)象影響點膠效果，全自動點膠機點錫膏的出現(xiàn)，在電子元件點錫膏應(yīng)用得到了良好的反應(yīng)。
According to the characteristics of solder paste, the automatic dispenser selects and adjusts the accessories of dispensing equipment to avoid the phenomenon of broken and uneven dispensing, which affects the dispensing effect. The appearance of solder paste in the automatic dispenser has a good response in the application of electronic components.